Cabinet clears 4 new semiconductor initiatives value Rs 4,600 cr

New Delhi

In a big push to India’s chip-making ambitions, the Union Cabinet chaired by Prime Minister Narendra Modi on Tuesday accredited 4 new semiconductor manufacturing initiatives with a complete funding of Rs 4,600 crore below the India Semiconductor Mission (ISM). The initiatives will increase home manufacturing of chips, packaging and superior supplies, producing over 2,000 expert jobs immediately.

Out of the 4 initiatives which have been accredited, two are in Odisha, one in Punjab, and one in Andhra Pradesh.

“Four new semiconductor projects have been approved. You know that six projects are already approved and four new ones have been added to it today. These are in Odisha, Andhra Pradesh and Punjab, at an investment of Rs 4,594 Crore,” Union Minister Ashwini Vaishnaw mentioned at a press convention in New Delhi at this time.

The approvals take the overall India Semiconductor Mission (ISM) portfolio to 10 initiatives throughout six states with cumulative investments of Rs 1.6 lakh crore. The authorities mentioned the transfer is in keeping with its imaginative and prescient of constructing a sturdy and self-reliant semiconductor ecosystem to help sectors starting from defence to client electronics.

Two of the accredited initiatives will come up in Odisha’s Info Valley, Bhubaneswar, making the state an rising hub for the sector.

SiCSem Private Limited will arrange the nation’s first business compound semiconductor fabrication facility, able to producing 60,000 wafers yearly and packaging 96 million models. The plant’s merchandise will cater to purposes in electrical autos, railways, quick chargers, information centres, photo voltaic inverters, client home equipment and missile methods.

The second Odisha venture, by 3D Glass Solutions Inc. (3DGS), will set up a sophisticated packaging and embedded glass substrate facility. It will introduce the world’s most superior semiconductor packaging expertise to India, with an annual capability of 69,600 glass panel substrates, 50 million assembled models and 13,200 3D Heterogeneous Integration (3DHI) modules. The expertise will probably be utilized in high-performance computing, synthetic intelligence, defence electronics, radio frequency and photonics purposes.

In Andhra Pradesh, Advanced System in Package (ASIP) Technologies, in collaboration with South Korea’s APACT Co. Ltd., will arrange a semiconductor manufacturing unit with a capability of 96 million models a yr. The plant will serve markets for cellular gadgets, set-top bins, automotive electronics and different purposes.

The fourth venture that was accredited by the Union Cabinet is for Continental Device India Ltd. (CDIL) in Mohali, Punjab, it would develop the corporate’s discrete semiconductor manufacturing capability. The upgraded facility will produce 158.38 million models of high-power gadgets yearly, together with MOSFETs, IGBTs, Schottky diodes and transistors in each silicon and silicon carbide. These elements are utilized in EV electronics, renewable power methods, energy conversion, industrial automation and communication infrastructure.

The approvals mark a decisive step in positioning India as a worldwide semiconductor hub. “These projects will accelerate our journey towards Atmanirbhar Bharat in electronics manufacturing and create a talent pool that will serve global industry,” the federal government mentioned in an announcement.

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The ISM has already attracted main investments and fostered a rising design ecosystem, with 72 startups and 278 educational establishments engaged in semiconductor R&D and coaching. Over 60,000 college students are benefitting from semiconductor expertise improvement programmes throughout the nation.