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Adeia has filed a pair of patent infringement lawsuits towards AMD within the U.S. District Court for the Western District of Texas, claiming that AMD’s chips incorporate patented improvements lined by its hybrid bonding IP portfolio.
The firm says ten patents are at problem — seven protecting hybrid bonding and three tied to course of nodes utilized in superior logic and reminiscence manufacturing. The litigation, introduced November 3, follows what Adeia describes as years of failed licensing talks. AMD has not but commented.
Hybrid bonding could be the foundation for the next phase of chip scaling, as performance gains shift from transistor density to vertical integration. AMD’s roadmap leans heavily on stacked designs, not just for Ryzen but for EPYC and future accelerators that layer compute, memory, and I/O. If Adeia’s claims survive early procedural challenges, the case could test how much of that stack belongs to the IP holder and how much to the foundry in any judgments that follow.
Few expect any near-term disruption to AMD’s products, since injunctions in patent cases of this kind are rarely granted under post-eBay v. MercExchange precedent. The more immediate question is whether Adeia’s claims can survive the early procedural hurdles that often decide the outcome long before trial.
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