These Indian Services Assist Assemble & Test the Chips That Power Your Devices

India is in the course of a large technological shift, transferring from being a major client of chips to aiming to change into a crucial international manufacturing hub. The nation’s semiconductor market is projected to greater than double, hovering from an estimated $45-50 billion in 2024-2025 to succeed in $100-110 billion by 2030. 

This development is backed by the federal government’s ₹76,000 crore India Semiconductor Mission (ISM). While fabrication (fab) models usually seize the headlines, the backend, particularly meeting, testing, marking and packaging (ATMP), often known as outsourced semiconductor meeting and take a look at (OSAT), is equally important to attaining ‘Make in India’ chip independence. 

Global giants like Micron and home leaders like Tata Electronics are pouring billions into these services, recognising their position in de-risking international provide chains and bringing high-value manufacturing capabilities onshore. 

As India prepares to roll out its first domestically packaged chips, under is a listing of probably the most crucial OSAT/ATMP services and corporations beneath the ISM defining India’s new semiconductor frontier.

Micron Technology 

Location: Sanand, Gujarat

Micron Technology, a US-based reminiscence chip big, is establishing a large-scale ATMP facility in Sanand, Gujarat, with a complete funding of roughly ₹22,516 crore (~ $2.75 billion). 

The undertaking was accredited in June 2023, changing into one of many first vital approvals beneath the ISM. Construction is deliberate in two phases, with Phase 1 anticipated to be operational by the second half of 2025.

This unit is crucial for establishing India’s presence within the international reminiscence and storage product provide chain. It caters to each home consumption and worldwide export markets and is predicted to generate vital direct and oblique employment.

Tata Semiconductor 

Location: Morigaon, Assam

Tata Group’s subsidiary, Tata Semiconductor Assembly and Test (TSAT), is establishing a greenfield ATMP facility in Morigaon, Assam, with an funding of roughly ₹27,000 crore. 

Approved in February 2024, this undertaking is about to change into a landmark industrial enterprise within the area, specialising in meeting and take a look at operations for a number of chip varieties.

Once operational, the power is anticipated to have a capability to fabricate as much as 48 million chips per day, serving a number of sectors together with automotive, client electronics, and telecom.

CG Power

Location: Sanand, Gujarat

CG Power and Industrial Solutions, in partnership with Japan’s Renesas Electronics Corporation and Thailand’s Stars Microelectronics, is growing an OSAT facility in Sanand, Gujarat, with a complete funding of over ₹7,600 crore. 

The unit, accredited in February 2024, is meant to offer full-spectrum chip meeting, packaging and testing, together with conventional and superior packages similar to system on built-in chip, quad flat package deal and ball grid array.

The undertaking is deliberate in two phases (G1 and G2), with a mixed eventual capability to scale as much as roughly 15 million models per day, specializing in functions throughout automotive, defence and industrial segments.

Kaynes Semicon 

Location: Sanand, Gujarat

Kaynes Semicon, a subsidiary of Kaynes Technology, acquired cupboard approval for its ATMP unit in Sanand, Gujarat, with an funding of ₹3,307 crore. This unit, accredited in September 2024, is designed to have a capability of over 6 million chips per day. 

The facility will manufacture chips for a broad vary of high-demand functions, together with electrical autos, industrial electronics, client electronics and cell phones, underscoring India’s dedication to constructing indigenous packaging capabilities.

HCL & Foxconn

Location: Jewar, Uttar Pradesh

A three way partnership between the HCL Group and Foxconn is establishing an OSAT facility close to the Jewar Airport in Uttar Pradesh, with an funding of roughly ₹3,706 crore. 

Approved beneath the ISM, the undertaking includes the meeting and packaging of show driver chips utilized in digital units similar to cell phones, laptops and cars.

The facility is predicted to have a capability of 20,000 wafers per thirty days, translating to an output of as much as 36 million packaged models per thirty days, supporting the show ecosystem in India.

3D Glass Solutions 

Location: Bhubaneswar, Odisha

3D Glass Solutions (3DGS) is establishing a vertically built-in superior packaging and embedded glass substrate unit in Info Valley, Odisha, backed by an funding of ₹1,943 crore. 

This unit will introduce the world’s most superior packaging expertise to India, specializing in 3D Heterogeneous Integration (3DHI) modules and glass interposers. 

Its deliberate annual capability consists of roughly 69,600 glass panel substrates and 50 million assembled models, focusing on high-value markets similar to defence, AI and high-performance computing.

Advanced System in Package Technologies 

Location: Andhra Pradesh

Advanced System in Package Technologies (ASIP), in technical collaboration with South Korea’s APACT, is establishing a chip packaging unit in Andhra Pradesh with an funding of ₹468 crore. 

This facility is designed to supply 96 million chip packaging models yearly, catering particularly to the wants of the cellular, automotive and common client electronics sectors. This undertaking will contribute to diversifying the geographic distribution of semiconductor packaging capabilities throughout India.

Continental Device

Location: Mohali, Punjab

Continental Device India Ltd (CDIL) is enterprise a brownfield enlargement of its present discrete semiconductor manufacturing facility at Mohali, Punjab, with an funding of ₹117 crore. 

This undertaking, accredited as one of many 4 not too long ago introduced non-ATMP tasks beneath the ISM, is technically an enlargement of an present discrete semiconductor manufacturing unit moderately than a brand new greenfield ATMP/OSAT facility. 

The enlargement will increase the manufacturing of high-power discrete semiconductor units like steel oxide semiconductor field-effect transistors (MOSFETs) and insulated gate bipolar transistors (IGBTs), in each silicon and silicon carbide. This will improve its annual capability by about 158.38 million models, considerably strengthening India’s capabilities in energy semiconductor units.

SicSem 

Type: Primarily a fab which incorporates OSAT operations as nicely. 

Location: Bhubaneswar, Odisha

SicSem Pvt Ltd, in collaboration with the UK-based Clas-SiC Wafer Fab, is establishing an built-in silicon carbide (SiC) primarily based compound semiconductor fab and ATMP facility in Info Valley, Odisha, with an funding of ₹2,066 crore. 

Although primarily a fab, the undertaking additionally features a substantial packaging part, that includes a deliberate annual packaging capability of 96 million models. This facility marks India’s first industrial compound semiconductor fab and is important for manufacturing high-performance chips for crucial functions like defence, EVs and solar energy inverters.

Polymatech Electronics 

Location: Chennai, Tamil Nadu

Polymatech Electronics, Chennai, Tamil Nadu, is a key private-sector participant within the manufacturing of opto-semiconductor chips, notably for LED functions. This facility represents a vital, non-ISM funding in semiconductor meeting and packaging associated to opto-electronics. 

It covers all the worth chain from chip manufacturing to packaging for high-power LED units, serving lighting functions and supporting the broader purpose of home semiconductor and electronics manufacturing.

SPEL Semiconductor

Location: Chennai, Tamil Nadu

SPEL Semiconductor is commonly cited as India’s pioneer and a long-standing home OSAT firm. Located in Chennai, Tamil Nadu, SPEL has been within the enterprise of meeting, packaging and testing for a number of years, serving home and worldwide purchasers.

Because it was established lengthy earlier than the ISM program, it’s typically thought-about a non-ISM OSAT, though any future enlargement might doubtlessly search new authorities incentives.