AMD hit with lawsuit over hybrid bonding tech behind potent 3D V-Cache — Adeia claims firm’s gaming chip infringes 10 of its patents

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Adeia has filed a pair of patent infringement lawsuits towards AMD within the U.S. District Court for the Western District of Texas, claiming that AMD’s chips incorporate patented improvements lined by its hybrid bonding IP portfolio.

The firm says ten patents are at problem — seven protecting hybrid bonding and three tied to course of nodes utilized in superior logic and reminiscence manufacturing. The litigation, introduced November 3, follows what Adeia describes as years of failed licensing talks. AMD has not but commented.


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